The worlds industries are growing fast and the demand of innovative and reliable technologies is increasing. Technical requirements of tomorrow will not be the same as they are today.
SiC opens up a lot of possibilities for costs-, size- and performance improvements at system level. This is especially true for high-switching frequency applications. However, implementation of SiC comes with several challenges requiring best-in-class packaging.
Customized, low-inductive package and pin-out allowing high switching speeds
Advanced bonding and joining technology (Danfoss Bond Buffer®)
Dedicated cooling technology (ShowerPower®)
Engineering SiC power modules can be challenging. To overcome the challenges, experience in electrical, thermal and mechanical design is key. Utilize our proven SiC track record and work together with our application experts to take your SiC application to the next level.
Silicon carbide comes with many advantages but it also requires the mastering of several technical design challenges.
Electrical design challenges
Thermal design challenges
Mechanical design challenges
The typical applications for SiC power modules are:
Danfoss engineers custom-made IGBT modules that fits exactly into your application requirements.
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Danfoss has developed a second-to-none portfolio of technologies to address the many challenges faced by automotive manufacturers and system suppliers designing traction inverters for e-mobility.
Motor drives are the backbone of modern global industry. They are well hidden, but nevertheless they play a key role. For decades, Danfoss has been designing, developing and manufacturing customized IGBT power modules for industrial motor drives.
Today, Danfoss works together with some of the world's most innovative and successful solar inverter manufacturers with a common mission of lowering the cost of solar energy enabling a transition to a more sustainable future
Learn more about what Silicon Carbide power modules are, how they work and why SiC is preferred in selected applications.
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