Full SiC power modules

Benefits:

• Reduces the semiconductor area for a more cost-effective solution
• Increases power density and thermal robustness
• Improved lifetime and reliability
   

About Danfoss Bond Buffer®

Increase power density without derating the current - while actually improving reliability and prolonging the lifetime of the module. Danfoss Bond Buffer® is a breakthrough in bonding and joining technology that helps you raise the bar for system performance. Our patented DBB® concept is based on an innovative combination of copper wire bonding and sintered die attach that replaces traditional solder joints.
DBB® technology enables power cycling capabilities that are 15 times higher than those seen in aluminum wire bonded power modules. This permits an operation at higher junction temperatures without the need for current derating. This increased power cycling capability makes it possible to optimize the dimensioning of the semiconductor area to increase the cost-effectiveness of the solution.

Benefits:

• Reduces the semiconductor area needed to achieve the desired output
• Enables highest power density on the market
• Eliminates the need for thermal interface material
• Low differential pressure-drop
• Homogeneous cooling
• Increases system lifetime
• More efficient than standard cooling 
   

About ShowerPower® 

Smart and efficient thermal management is an essential part of the Danfoss technology portfolio allowing us to deliver higher system performance. Offering highly efficient direct liquid cooling, our patented ShowerPower® concept utilizes several meandering cooling channels to guide the coolant along the baseplate. This design improves thermal performance by creating a swirl effect in the cooling channels. This means that the coolant is constantly brought into contact with the surface that requires cooling. The concept almost doubles the effective heat transfer coefficient, to enable much higher current carrying capability.

Benefits:

• Superior mechanical robustness
• Stable at higher operation temperatures and temperature cycles
• Increased power density
• Protected against humidity
• Longer lifetime
   

About transfer molding

Multiple applications such as electric drivetrains operating under demanding conditions benefit from our unique transfer molded packaging design. Sealed and protected against vibrations and humidity, the inverter provides stable and reliable performance - even when subjected to mechanical shocks and damp environments. Transfer molding in combination with our bond buffer technology allows for more extreme temperature cycling and higher junction temperatures to increase power density.

• Highest efficiency
  SiC offers highest efficiency due to reduced switching losses.
  
  
• Power density
  Excellent output power and power densities are reached in combination with high switching frequencies, minimal losses and maximum efficiency.
  
  
• Lower overall system costs
  The increase in switching frequency means passive filter components can be drastically reduced. Power losses are reduced at the same time, resulting in smaller heat sinks and reducing cooling needs in general. Both benefits result in a major decrease in overall system costs.

Silicon carbide comes with many advantages but it also requires the mastering of several technical design challenges.

Electrical design challenges

• DC stray inductance
• Paralleling of multiple chips
• Parasitic turn-on (high dv/dt)
• Gate oxide reliability
  
  

Thermal design challenges

• Lowest Rth
• Lowest pressure drop
• Parallel cooling

Mechanical design challenges

• Elevated temperatures
• Power cycling capability
• Terminals and connectors

The typical applications for SiC power modules are:

• Power Supply
• EV charging
• Solar inverters
• Motor drives
• Energy storage
• E-mobility

• Make the most out of SiC by utilizing our patented technologies 
• Proven track record in SiC applications
• World-class SiC Compentence Center in Munich, Germany
• Choose your chip - we're fully compatible